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Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

محصولات

سامسونگ ماشین انتخاب و قرار دادن

دستگاه انتخاب و قرار دادن FUJI

بارگیری کننده PCB بارگیری کننده PCB

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

مقدار تولیدی:	1 set/sets
قیمت:	قابل مذاکره
بسته بندی استاندارد:	wooden box
دوره تحویل:	5-8 days
روش پرداخت:	T/T, Western Union, Paypal, Credit card
ظرفیت تامین:	5000

اطلاعات دقیق

توضیحات محصول

اطلاعات دقیق

Place of Origin

China

نام تجاری

Model Number

WZ-GX01

Product name:

die bonding machine

Solid crystal cycle:

>40 ms

Dispensing heating:

constant temperature

Resolution:

0.5 um

Fetching pressure:

20-200g

Power:

1.3 KW

Weight:

Dimension(L*W*H):

1545*1080*1715 mm

توضیحات محصول

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.

1,Full automatic up load and down load materials.

2,Module design,max optimization structure.

3,Full intellectual property right.

4,Picking die and Bonding die dual PR system.

5,Multi-wafer ring,dual glue ect configuration.

Wafer Stage System

The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y

platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with

servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.

Feeding and Receiving System

The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the

precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked

according to actual needs, and the left and right material boxes can be quickly switched.

Imaging system

The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel

and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and

the Z-axis adjustment platform controls the focal length adjustment.

Product name	die bonding machine
Solid crystal cycle	>40 ms
Die bonding position accuracy	±0.3 mil
Dispensing heating	constant temperature
Resolution	0.5 um
Chip ring size	6 inch
Image identification	256 gray scale
Fetching pressure	20-200 g
Frequency	50 HZ
Dimension(LWH)	154510801715 mm
Weight	1040
Voltage	220 V
Power	1.3 KW

Swing arm system

The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the

swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation

and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and

stability.

Operating system

It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth

operation, which is in line with the operation habits of Chinese people.

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine 0

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جزئیات محصولات

محصولات

SMT Pick and Place Machine

سامسونگ ماشین انتخاب و قرار دادن

دستگاه انتخاب و قرار دادن FUJI

دستگاه انتخاب و مکان JUKI

فر SMT

دستگاه SMT AOI

تجهیزات خط SMT

دستگاه موج جوش

چاپگر استنسل SMT

فیدر SMT

نوزل SMT

دستگاه بازرسی SMT

بارگیری کننده PCB بارگیری کننده PCB

نوار نقاله PCB

دستگاه DIP SMT

قطعات smt

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

مقدار تولیدی:	1 set/sets
قیمت:	قابل مذاکره
بسته بندی استاندارد:	wooden box
دوره تحویل:	5-8 days
روش پرداخت:	T/T, Western Union, Paypal, Credit card
ظرفیت تامین:	5000

اطلاعات دقیق

توضیحات محصول

اطلاعات دقیق

Place of Origin

China

نام تجاری

Model Number

WZ-GX01

Product name:

die bonding machine

Solid crystal cycle:

>40 ms

Dispensing heating:

constant temperature

Resolution:

0.5 um

Fetching pressure:

20-200g

Power:

1.3 KW

Weight:

1040

Dimension(L*W*H):

1545*1080*1715 mm

Minimum Order Quantity:

1 set/sets

قیمت:

قابل مذاکره

Packaging Details:

wooden box

Delivery Time:

5-8 days

Payment Terms:

T/T, Western Union, Paypal, Credit card

Supply Ability:

5000

توضیحات محصول

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine

Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.

1,Full automatic up load and down load materials.

2,Module design,max optimization structure.

3,Full intellectual property right.

4,Picking die and Bonding die dual PR system.

5,Multi-wafer ring,dual glue ect configuration.

Wafer Stage System

The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y

platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with

servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.

Feeding and Receiving System

The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the

precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked

according to actual needs, and the left and right material boxes can be quickly switched.

Imaging system

The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel

and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and

the Z-axis adjustment platform controls the focal length adjustment.

Product name	die bonding machine
Solid crystal cycle	>40 ms
Die bonding position accuracy	±0.3 mil
Dispensing heating	constant temperature
Resolution	0.5 um
Chip ring size	6 inch
Image identification	256 gray scale
Fetching pressure	20-200 g
Frequency	50 HZ
Dimension(LWH)	154510801715 mm
Weight	1040
Voltage	220 V
Power	1.3 KW

Swing arm system

The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the

swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation

and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and

stability.

Operating system

It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth

operation, which is in line with the operation habits of Chinese people.

Dual Head High Speed Die Bonder Die Attach Machine For Semiconductor Manufacturing Machine 0

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